Axiro Semiconductor Pvt. Ltd. is a leading fabless semiconductor company based in Bengaluru, India, specializing in high-performance chip design for global 5G/6G, defence, satellite communication, and industrial IoT markets. Backed by the Murugappa Group through CG Power, Axiro leverages advanced design capabilities and strategic global manufacturing partnerships to deliver millions of ICs. With a strong focus on innovation, IP ownership in India, and sustainable growth, Axiro is at the forefront of India’s semiconductor mission.
Job Description
As an Associate Package Development Engineer, you will support the industrialization and manufacturing readiness of new semiconductor package designs by working closely with senior engineers and external OSATs. In this role, you will assist in documenting and validating package construction details, managing material data, and supporting engineering builds. This is a hands-on, growth-oriented role ideal for a recent graduate eager to gain experience in IC packaging technology, assembly flows, and new product introduction (NPI) processes. You will contribute to ensuring packaging solutions meet design intent, reliability standards, and manufacturing requirements across RF and mixed-signal products. You’ll also support sustaining activities, supplier coordination, and data analysis to drive continuous improvement and quality.
Responsibilities
Package Design Translation & OSAT Enablement
- Interpret package-level design intent from the internal Package Design team and translate it into OSAT-compatible specifications.
- Assist in reviewing package construction details (e.g., package type, stack-up, routing constraints, electrical/mechanical design rules) for manufacturability.
- Support the development and release OSAT-facing assembly process documentation, package build flows, material specifications and tooling requirements.
- Participate in design reviews and provide implementation support at OSATs, including DRC feedback tracking and readiness checklists.
Tooling & Supplier Setup
- Assist in review of tooling setup and kickoff with OSATs for substrates, leadframes, mold tools, bond programs, die placement tools, and singulation methods.
- Support tracking and documentation of tooling readiness for engineering builds.
- Help monitor OSAT NPI timelines to ensure alignment with product schedules.
Qualification Lot Planning
- Track qualification lot progress and reliability test status (e.g., HTOL, TC, uHAST).
- Support preparation of documentation for MSL classification, PPAP submissions, and JEDEC/AEC compliance.
- Assist with material planning for assembly characterization builds and help summarize result
Manufacturing Support & Issue Resolution
- Provide assembly quality monitoring support during engineering builds and ramp.
- Assist in root cause analysis and corrective action implementation for packaging-related yield or reliability issues.
- Communicate with OSAT teams to clarify process requirements and quality feedback.
Packaging BOM Ownership
- Ensure timely release and documentation of BOM in PLM system. Package Design Review and DRC Sign-off
- Participate in package design reviews and validate against electrical/mechanical DRC.Thermal/Mechanical Simulation Coordination
- Work with simulation teams or OSATs to perform analysis of:
o Thermal modeling.
o Warpage of packages and substrates.
- Reviewing simulation results to support material selection or package stack-up decisions.
Documentation & Compliance
- Review assembly drawings and Package Outline Drawings (PODs) for completeness and alignment with internal requirements.
- Coordinate supplier-provided material declarations and support IMDS submissions to meet regulatory compliance (e.g., RoHS, REACH).
DFM & Yield Optimization
- Provide Design for Manufacturability (DFM) feedback to design and layout teams.
- Assist in yield data analysis and package cost/yield trade-off studies.
- Perform analysis for packaging-related cost/yield tradeoff studies.
Sustaining Engineering & Change Management
- Support ECNs/PCNs for package material or process changes.
- Execute package improvement projects for reliability, cost, or quality enhancement.
Vendor Benchmarking & Cost Analysis
- Help identify cost-reduction initiatives through material/process changes or second-sourcing.