Axiro Semiconductor Pvt. Ltd. is a leading fabless semiconductor company based in Bengaluru, India, specializing in high-performance chip design for global 5G/6G, defence, satellite communication, and industrial IoT markets. Backed by the Murugappa Group through CG Power, Axiro leverages advanced design capabilities and strategic global manufacturing partnerships to deliver millions of ICs. With a strong focus on innovation, IP ownership in India, and sustainable growth, Axiro is at the forefront of India’s semiconductor mission.

Job Description

As a PrincipalTechnical Project Manager at Axiro, you will leverage your deep expertise to guide advanced mmwave and RF ICs through their entire product lifecycle. This pivotal role is critical for the efficient execution of new product introductions, directly influencing revenue attainment and gross margin enhancements. You will take direct ownership of large scale projects and be the leading force in the development cycle of new products, managing both the schedule, planning, and budget for the cross-functional team.

Responsibilities 

• Take full ownership of the project execution, scheduling, and budgeting.
• Define clear timelines and KPIs for the projects and closely monitor the overall performance.
• Monitor and optimize the NPI execution flow by closely working with the cross functional team
• Operate as the main interface between the NPI team and backend operations and OSATs.
• Monitor the material management for NPI and track proto hardware development and availability
• Work with the executive team on business feasibility reports and optimization of cost structures.

Continuously identify enhancements to the NPI process, focusing on efficiency and reduction of overhead

Requirements

• 10+ years experience in IC NPI management with global cross-functional teams
• Experience in bringing new products from definition to production release
• Extensive experience in RFIC production and managing complex IC development projects
• Knowledge of operation and testing of RFIC and mixed signal products for wireless and satellite applications
• Knowledge in IC manufacturing process and failure analysis techniques
• Good critical thinking skills to troubleshoot a variety of challenging issues
• Good communication, team working, and organizational skills