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Staff/Sr. Staff RF/mmWave EM and PCB & Package Design Engineer

Axiro Semiconductor Pvt. Ltd. is a leading fabless semiconductor company based in Bengaluru, India, specializing in high-performance chip design for global 5G/6G, defence, satellite communication, and industrial IoT markets. Backed by the Murugappa Group through CG Power, Axiro leverages advanced design capabilities and strategic global manufacturing partnerships to deliver millions of ICs. With a strong focus on innovation, IP ownership in India, and sustainable growth, Axiro is at the forefront of India’s semiconductor mission.

Job Description

We are seeking a Staff/Sr. Staff EM and PCB Design Engineer to join our dynamic and innovative design team. This critical role involves developing advanced circuits and boards for 5G and Satcom applications. As a key member in this highly visible position, you will collaborate closely with a cross-functional team to deliver groundbreaking solutions at mmWave frequencies. The ideal candidate is a highly motivated and skilled problem-solver with profound expertise in EM/RF passive, package and PCB design, and a solid background in EM and communication systems.

Responsibilities 

    Design advanced package solutions for mmWave and RF front-end ICs.

    • Design antennas and passive RF circuits for mmWave phased array application.
    • Design evaluation or demo boards for mmWave products.
    • Run feasibility and tradeoff studies for PCB stack-up optimization and board planning.
    • Design and simulate on-chip EM structures as well as IC/package/PCB interfaces.
    • Deliver PCB schematic and layout for evaluation and demo boards at mmWave frequencies.
    • Support full-cycle of test & design validation, including hardware-to-simulation correlation  studies.
    • Engage with vendors and partners to build strong collaborative relationships.

Requirements

    Master's degree with 5+ years of industry experience or a Ph.D. with 3+ years industry experience in Electronics/Electrical Engineering

    • 5+ years of experience in antenna and passive RF circuit & PCB design
    • Experience in EM simulations both for on-chip, IC package and PCB interfaces.
    • Proficiency in EM simulation tools, such as HFSS, EMX and Momentum, etc.
    • Solid understanding of PCB manufacturing process.
    • Experience with phased arrays is highly desirable.
    • Knowledge and experience with Orcad CIS and Allegro are a plus.
    • Hands-on lab experience, including the use of essential test equipment such as VNAs, Spectrum Analyzers, and Anechoic Chambers.
    • Strong communication skills and a proven ability to work effectively in a team environment.
    Job Title

    Staff/Sr. Staff RF/mmWave EM and PCB & Package Design Engineer

    Department

    Sub-8 (PA)

    Designation

    Senior engineer

    Location

    India

    Requisition ID

    AXR-TA-0016