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Staff/Sr. Staff RF/mmWave EM and PCB & Package Design Engineer

Axiro Semiconductor Pvt. Ltd. is a leading fabless semiconductor company based in Bengaluru, India, specializing in high-performance chip design for global 5G/6G, defence, satellite communication, and industrial IoT markets. Backed by the Murugappa Group through CG Power, Axiro leverages advanced design capabilities and strategic global manufacturing partnerships to deliver millions of ICs. With a strong focus on innovation, IP ownership in India, and sustainable growth, Axiro is at the forefront of India’s semiconductor mission.

Job Description

We are seeking a Staff/Sr. Staff EM and PCB Design Engineer to join our dynamic and innovative design team. This critical role involves developing advanced circuits and boards for 5G and Satcom applications. As a key member in this highly visible position, you will collaborate closely with a cross-functional team to deliver groundbreaking solutions at mmWave frequencies. The ideal candidate is a highly motivated and skilled problem-solver with profound expertise in EM/RF passive, package and PCB design, and a solid background in EM and communication systems.

Duration: Regular

Responsibilities 

  • Design advanced package solutions for mmWave and RF front-end ICs.
  • Design antennas and passive RF circuits for mmWave phased array application.
  • Design evaluation or demo boards for mmWave products.
  • Run feasibility and tradeoff studies for PCB stack-up optimization and board planning.
  • Design and simulate on-chip EM structures as well as IC/package/PCB interfaces.
  • Deliver PCB schematic and layout for evaluation and demo boards at mmWave frequencies.
  • Support full-cycle of test & design validation, including hardware-to-simulation correlation studies.
  • Engage with vendors and partners to build strong collaborative relationships.

Requirements

  • Master's degree with 7+ years of industry experience or a Ph.D. with 5+ years industry experience in Electronics/Electrical Engineering
  • 5+ years of experience in antenna and passive RF circuit & PCB design
  • Experience in EM simulations both for on-chip, IC package and PCB interfaces.
  • Proficiency in EM simulation tools, such as HFSS, EMX and Momentum, etc.
  • Solid understanding of PCB manufacturing process.
  • Experience with phased arrays is highly desirable.
  • Knowledge and experience with Orcad CIS and Allegro are a plus.
  • Hands-on lab experience, including the use of essential test equipment such as VNAs, Spectrum Analyzers, and Anechoic Chambers.
  • Strong communication skills and a proven ability to work effectively in a team environment.
  • Job Title

    Staff/Sr. Staff RF/mmWave EM and PCB & Package Design Engineer

  • Department

    Engineering

  • Location

    Turkey – Istanbul office or Bengaluru